Kamis, 21 Juli 2016

BACK-END PROCESS ENGINEER / R & D PLATING (up $ 3.8k | 3-5 YRS | WEST)

JOB DESCRIPTION

Successful candidates will join one of Japanese MNC with an extensive network in the semiconductor technology industry.
as part of their recent plans expansions, our client is looking for a dynamic and committed to join their rapid growth. team

PROCESS ENGINEER backend / R & D -PLATING (up $ 3.8k | 3-5 YRS | WEST)

responsibilities
  • Perform Semiconductor process engineering in the field of the wafer / plating process
  • responsible optimization of product quality processes, improving performance and troubleshooting
  • Design, configuration and conduct experiments
  • evaluation of experimental results, statistical process control data to deduce the conclusion for process improvement and stability
Requirements
  • License Materials science / chemical Engineering or equivalent qualification
  • 3 - 5 years working experience in Electroplating / semiconductor industry
Other information
  • working location: Pioneer area with the transport company provided
  • 5 days, 8-5pm
  • basic $ 3300 - $ 3800 depends on experience

HOW tO APPLY
Alternatively you can also send your resume to us jessgan@mci.com.sg
for more information, you can contact 6807 6113



Gan Zhi Ying (Jess)
local staffing Division | Registration number: R1439633
MCI Career Services Pte Ltd. EA Licence No: 06C2859

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